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CPU i3 530
| Status | |
| Launch Date | Q1'10 |
| Processor Number | i3-530 |
| # of Cores | 2 |
| # of Threads | 4 |
| Clock Speed | 2.93 GHz |
| Intel® Smart Cache | 4 MB |
| DMI | 2.5 GT/s |
| Instruction Set | 64-bit |
| Instruction Set Extensions | SSE4.2 |
| Embedded Options Available
|
No |
| Lithography | 32 nm |
| Max TDP | 73 W |
| VID Voltage Range | 0.6500V-1.400V |
| Recommended Customer Price |
| Memory Specifications | ||
| Max Memory Size (dependent on memory type) | 16 GB | |
| Memory Types | DDR3-1066/1333 | |
| # of Memory Channels | 2 | |
| Max Memory Bandwidth | 21 GB/s | |
| Physical Address Extensions | 36-bit | |
| Graphics Specifications | ||
| Processor Graphics ‡ | Intel® HD Graphics | |
| Graphics Base Frequency | 733 MHz | |
| Intel® Flexible Display Interface (Intel® FDI) | Yes | |
| Intel® Clear Video HD Technology | Yes | |
| # of Displays Supported ‡ | 2 | |
| PCI Express Revision | 2.0 |
| PCI Express Configurations ‡ | 1x16, 2x8 |
| Max # of PCI Express Lanes | 16 |
| Package Specifications | ||
| Max CPU Configuration | 1 | |
| TCASE | 72.6°C | |
| Package Size | 37.5mm x 37.5mm | |
| Processing Die Size | 81 mm2 | |
| # of Processing Die Transistors | 382 million | |
| Graphics and IMC Lithography | 45 nm | |
| Graphics and IMC Die Size | 114 mm2 | |
| # of Graphics and IMC Die Transistors | 177 million | |
| Sockets Supported | FCLGA1156 | |
| Low Halogen Options Available | See MDDS | |